List of Qualcomm Snapdragon systems on chips

Qualcomm Snapdragon

General information
Launched	November 2007 (17 years ago) (2007-11)
Designed by	Qualcomm
Architecture and classification
Application	Mobile SoC and 2-in-1 PC
Microarchitecture	ARM9, ARM11, ARM Cortex-A, Cortex-X1, Cortex-X2, Cortex-X3, Cortex-X4, Scorpion, Krait, Kryo, Oryon
Instruction set	ARMv6, ARMv7-A, ARMv8-A, ARMv9-A
Physical specifications
Cores	1, 2, 4, 6, 8 or 12

The Qualcomm Snapdragon suite of systems on chips (SoCs) are designed for use in smartphones, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices.

SoC made by Qualcomm before it was renamed to Snapdragon.^[1]

• MSM (Mobile Station Modem)
• QSC (Qualcomm Single Chip)

Model number	Fab	CPU	GPU (or Gfx Core)	Connectivity	Sampling availability
QSC1xxx[2]
QSC1100	65 nm	ARM926EJ-S @ 96/128 MHz[3]		CDMA	Q4 2007
QSC1110
QSC1105		ARM926EJ-S @ 211 MHz		CDMA	2010
QSC1215					Q3 2012
QSC6xxx[2]
QSC6010[4]		ARMv5TEJ ARM926EJ-S	No 3D, ARM 2D	CDMA	2006
QSC6020
QSC6030
QSC6055[5]	65 nm	ARM926EJ-S @ 192 MHz		HSDPA, 1xEV-DO	Q1 2007
QSC6065				HSDPA, 1xEV-DO	Q2 2007
QSC6075[6]				1xEV-DO Rev.0
QSC6085				1xEV-DO Rev.A	Q4 2007
QSC6155[7]	45 nm	ARM1136JF-S @ 480 MHz w/ L2	HVGA @30fps	GSM, EDGE, HSPA+ EV-DO Rev.0/A/B	2008
QSC6165
QSC6175
QSC6185
QSC6195
QSC6240 (ESC6240)	65 nm	ARM926EJ-S @ 184/230 MHz	No 3D, ARM 2D	HSDPA	Q3 2007
QSC6245-1
QSC6260-1				GSM, GPRS, EDGE, HSDPA
QSC6270[8] (ESC6270)
QSC6290	45 nm	ARM926EJ-S @ 300 MHz	WQVGA @15fps	HSUPA, UMTS	2009
QSC6285	45 nm	ARM1136JF-S @ 480 MHz w/ L2	aDSP @ 160 MHz	CDMA 2000, GSM, GPRS, EDGE, EV-DO Rel.0, BT 3.0	2009
QSC6295 (ESC6295)
QSC6695
MSM3xxx[2]
MSM3000	350 nm	ARM7TDMI[9]		CDMA	Feb 1998
MSM3100					Feb 1999
MSM3300					2000
MSM5xxx[2]
MSM5000		ARM7TDMI		CDMA 2000	2000
MSM5100[10]		ARM7TDMI @ 50 MHz		CDMA, AMPS, PCS	2002
MSM5105		ARM7TDMI @ 27 MHz
MSM5500		ARM7TDMI @ 50 MHz
MSM6xxx[2]
MSM6000[11]		ARM7TDMI @ 20 MHz		CDMA	2005
MSM6025
MSM6050		ARM7TDMI @ 40 MHz
MSM6100		ARM926EJ-S @ 146 MHz	ARM-DSP 3D, ARM 2D	CDMA	2006
MSM6125
MSM6150			Defender2 3D, ARM 2D
MSM6175
MSM6225			No 3D, ARM 2D	HSDPA
MSM6250		ARM926EJ-S @ 180 MHz	ARM-DSP 3D, ARM 2D	WCDMA	2006
MSM6250A			No 3D, ARM 2D
MSM6245		ARM926EJ-S @ 180 MHz		WEDGE
MSM6255A
MSM6260		ARMv5TEJ ARM926EJ-S @ 225 MHz[12]	ARM-DSP 3D, ARM 2D	HSUPA
MSM6275			Defender2 3D, ARM 2D
MSM6280
MSM6280A			Stargate 3D, ARM 2D		2007
MSM6500[13]	130 nm	ARMv5TEJ ARM926EJ-S @ 150 MHz[14]	ARM-DSP 3D, ARM 2D	1xEV-DO Rev.0	2006
MSM6575			Defender3 3D, ARM 2D	1xEV-DO Rev.0	2006
MSM6550		ARMv5TEJ ARM926EJ-S @ 225 MHz[15]	Defender2 3D, ARM 2D
MSM6550A
MSM6800		ARM926EJ-S @ 270 MHz	Defender3 3D, ARM 2D	1xEV-DO Rev.A	2007
MSM6800A
MSM7xxx
MSM7200	90 nm	ARM1136J-S @ 400 MHz[16]	Imageon 2D, 3D	HSUPA	2006
MSM7200A		ARM1136J-S @ 528 MHz[17]			Q1 2007
MSM7201	90 nm	ARM1136JF-S @ 528 MHz[18][19]	GPU Adreno 130	HSDPA, HSUPA	2008
MSM7201A	65 nm
MSM7500	90 nm	ARM1136JF-S @ 528 MHz[20]	Imageon 2D, 3D Q3Dimension	1xEV-DO Rev.A	2006
MSM7500A	65 nm				Q4 2007
MSM7600	90 nm	ARM1136J-S @ 528 MHz[18][19]		HSUPA, 1xEV-DO Rev.A	Q1 2007
MSM7600A	65 nm
MSM7850			LT 3D, LT 2D	1xEV-DO Rev.B	2008

Features of the Snapdragon S1 series

Snapdragon S1 notable features over its predecessor (MSM7xxx): CPU features 1 core up to 1 GHz Scorpion or Cortex-A5 or ARM11 Up to 256K L2 cache Up to 32K+32K L1 cache GPU features Adreno 200 (from Software rendered or Adreno 130) OpenGL ES 1.1 OpenVG 1.0 Direct3D Mobile Unified shader model 5-way VLIW DSP features Hexagon QDSP5 at 350 MHz or Hexagon QDSP6 600 MHz ISP features Up to 12 MP camera Modem and wireless features External Bluetooth 4.0 or external Bluetooth 2.0/2.1 on some models 45 or 65 nm manufacturing technology[21]

Model number	Fab	CPU (Core/Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM7225[22]	65 nm	1 core up to 528 MHz ARM11 (ARMv6): 16K+16K L1, no L2 cache	Software- rendered 2D support (HVGA)	Hexagon QDSP5 320 MHz	Up to 5 MP camera	LPDDR Single-channel 166 MHz (1.33 GB/s)	UMTS (HSPA); GSM (GPRS, EDGE)	Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0	2007
MSM7625[22]							CDMA (1× Rev. A, 1×EV-DO Rev. A); UMTS; GSM
MSM7227[22]		1 core up to 800 MHz ARM11 (ARMv6): 16K+16K L1, 256K L2 cache	Adreno 200 226 MHz (FWVGA)		Up to 8 MP camera	LPDDR Single-channel 166 MHz (1.33 GB/s)	UMTS; GSM	Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0	2008
MSM7627[22]							CDMA, UMTS; GSM
MSM7225A[22]	45 nm	1 core up to 800 MHz Cortex-A5 (ARMv7): 32K+32K L1, 256K L2 cache	Adreno 200 245 MHz (HVGA)	Hexagon QDSP5 350 MHz	Up to 5 MP camera	LPDDR Single-channel 200 MHz (1.6 GB/s)	UMTS (HSDPA, HSUPA, W-CDMA), MBMS; GSM	Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0	Q4 2011
MSM7625A[22]							CDMA2000 (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM
MSM7227A[22]		1 core up to 1.0 GHz Cortex-A5 (ARMv7): 32K+32K L1, 256K L2 cache	Adreno 200 245 MHz (FWVGA)		Up to 8 MP camera		UMTS, MBMS; GSM
MSM7627A[22]							CDMA2000, UMTS, MBMS; GSM
MSM7225AB[22]							UMTS: up to 7.2 Mbit/s, MBMS; GSM[23][24]
QSD8250[22]	65 nm	1 core up to 1.0 GHz Scorpion (ARMv7): 32K+32K L1, 256K L2 cache	Adreno 200 226 MHz (WXGA)	Hexagon QDSP6 600 MHz	Up to 12 MP camera	LPDDR Single-channel 400 MHz	UMTS, MBMS; GSM	Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0	Q4 2008
QSD8650[22]							CDMA2000, UMTS, MBMS; GSM

Features of the Snapdragon S2 series

Snapdragon S2 notable features over its predecessor (Snapdragon S1): CPU feature 1 core up to 1.5 GHz Scorpion ARMv7 (from ARMv6 on some model) Up to 384K L2 GPU features Adreno 205 (from Software rendered or Adreno 200) Up to 266 MHz Up to 2 times faster than Adreno 200[25] up to ×2 relative performance on OpenGL ES 2.0 from Adreno 200[26] Up to XGA OpenGL ES 2.0 SVGT 1.2[27] OpenVG 1.1 Direct Draw GDI Concurrent CPU, DSP, graphics and MDP[27] Memory features Up to LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s) DSP features Hexagon QDSP5 at 256 MHz 45 nm manufacturing technology 904 pins[28]

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM7230[22]	45 nm	1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2	Adreno 205 266 MHz (XGA)	Hexagon QDSP5 256 MHz	Up to 12 MP camera	LPDDR2 32-bit dual-channel 333 MHz[29] (5.3 GB/s)	GSM, GPRS, W-CDMA, UMTS, EDGE, MBMS, HSDPA, HSUPA, HSPA+	Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0	Q2 2010
MSM7630[22]							CDMA2000 (1×Adv,[30] 1×EV-DO Rel. 0/Rev. A/Rev. B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM
APQ8055[22]		1 core up to 1.4 GHz Scorpion: 32K+32K L1, 384K L2					—
MSM8255[22]		1 core up to 1.0 GHz Scorpion: 32K+32K L1, 384K L2					UMTS, MBMS; GSM
MSM8655[22]							CDMA2000, UMTS, MBMS; GSM
MSM8255T[22]		1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2					UMTS, MBMS; GSM
MSM8655T[22]							CDMA2000, UMTS, MBMS; GSM

Features of the Snapdragon S3 series

Snapdragon S3 notable features over its predecessor (Snapdragon S2): CPU feature 2 cores up to 1.7 GHz Scorpion 512 KB L2 GPU features Adreno 220 Up to 4 times faster than Adreno 200[25] up to ×5 relative performance on OpenGL ES 2.0 from Adreno 200[26] EGL 1.3 (from 1.2)[27] 2× larger L2 cache (512 KB from 256 KB) Up to WXGA+ DSP features Hexagon QDSP6 at 400 MHz (from Hexagon QDSP5 at 256 MHz) ISP features Up to 16 MP camera (from 12 MP) 45 nm manufacturing technology

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
APQ8060[22]	45 nm	2 cores up to 1.7 GHz Scorpion: 512 KB L2	Adreno 220 266 MHz (WXGA+)	Hexagon QDSP6 400 MHz	Up to 16 MP camera	LPDDR2 Single- channel 333 MHz (2.67 GB/s)	—	Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0	2011
MSM8260[22]							GSM, GPRS, W-CDMA, UMTS, HSDPA, HSUPA, HSPA+, EDGE, MBMS		Q3 2010
MSM8660[22]							CDMA2000 (1×Adv,[30] 1×EV-DO Rel. 0/Rev. A/Rev. B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM[31]

Snapdragon S4 was offered in three models: S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices.^[32] It was launched in 2012. The Snapdragon S4 were succeeded by the Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro).

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8225[32]	45 nm	2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2	Adreno 203 320 MHz (FWVGA)	Hexagon	Up to 8 MP camera	LPDDR2 Single-channel 300 MHz	UMTS (HSPA); GSM (GPRS, EDGE)	Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0	1H 2012
MSM8625[32]							CDMA (1×Rev. A, 1×EV-DO Rev. A/B); UMTS; GSM

Features of the Snapdragon S4 Plus series

Snapdragon S4 Plus notable features over its predecessor (Snapdragon S3): CPU features 2x cores up to 1.7 GHz Krait 200 4+4 KB L0, 16+16 KB L1, 1 MB L2 Out of Order Execution (from Partial Out of Order Execution on Scorpion) GPU features Adreno 225 Up to 1080p screen Up to 6 times faster than Adreno 200[25] Up to 32 ALU Direct3D feature level 9.0 (from 9.0)[25] up to ×7.5 relative performance on OpenGL ES 2.0 from Adreno 200[26] Adreno 305 Up to 1080p screen (on 400 MHz) Up to 720p screen (on 320 MHz) Up to 24 ALU (from 32 on S3) Unified shader model Scalar instruction set (from unified shader model 5-way VLIW) up to ×8 relative performance on OpenGL ES 2.0 from Adreno 200[26] DSP features Up to 20 MP or 13.5 MP camera ISP features Hexagon QDSP6 Modem and wireless features Integrated Bluetooth 4.0 IZat Gen8A (from IZat Gen 7)[33] 28 nm manufacturing technology

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8227[32]	28 nm	2 cores up to 1.0 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 305 320 MHz (FWVGA / 720p)	Hexagon QDSP6		LPDDR2 Single-channel 400 MHz	GSM (GPRS, EDGE), UMTS (DC-HSPA+, TD-SCDMA)	Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0	2H 2012
MSM8627[32]							CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS; GSM
APQ8030[32]		2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 305 400 MHz (qHD / 1080p)		Up to 13.5 MP camera	LPDDR2 Single-channel 533 MHz	— .		3Q 2012
MSM8230[32]							UMTS; GSM .
MSM8630[32]							CDMA, UMTS; GSM
MSM8930[32]							World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA, UMTS; GSM)
APQ8060A[32]		2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 225 400 MHz (WUXGA / 1080p)		Up to 20 MP camera	LPDDR2 Dual-channel 500 MHz	— .		2H 2012
MSM8260A[32]							UMTS; GSM .		Q1 2012
MSM8660A[32]							CDMA, UMTS; GSM
MSM8960[32][34]							World Mode (LTE Cat 3)

Features of the Snapdragon S4 Pro series

Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play): CPU features up to 2 cores up to 1.7 GHz Krait 300 on to Snapdragon S4 Pro up to 4 cores up to 1.5 GHz Krait 300 on to Snapdragon S4 Prime 4+4 KB L0, 16+16 KB L1, 1 MB L2 GPU features Adreno 320 Support OpenGL ES 3.0 Up to 1080p screen Up to 64 ALU (from 32 on S4 plus) up to ×23 relative performance on OpenGL ES 2.0 from Adreno 200[26] DSP features Hexagon QDSP6 ISP features Up to 20 MP camera Modem and wireless features LTE FDD/TDD Cat 3 or external on some models 28 nm LP manufacturing technology Up to eMMC 4.4/4.4.1

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8260A Pro[32]	28 nm (TSMC 28LP)	2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 320 400 MHz (WUXGA / 1080p)	Hexagon QDSP6	Up to 20 MP camera	LPDDR2 Dual-channel 500 MHz	GSM (GPRS, EDGE), UMTS (DC-HSPA+, TD-SCDMA)	Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0
MSM8960T[32]							World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM)		Q2 2012 .
MSM8960T Pro[32][35] (MSM8960AB)
MSM8960DT[36]		2 cores up to 1.7 GHz Krait 300:[a] 4+4 KB L0, 16+16 KB L1, 1 MB L2							Q3 2013
APQ8064[34][37]		4 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno 320 400 MHz (QXGA / 1080p)			LPDDR2 Dual-channel 533 MHz	External		2012

The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Model number	Product name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
MSM8225Q[38]	Snapdragon 200	45 nm (TSMC 45LP)	4 cores up to 1.4 GHz Cortex-A5	Adreno 203 400 MHz (12.8 GFLOPS in FP32)	Hexagon QDSP5	Up to 8 MP single camera	LPDDR2 Single-channel 333 MHz	Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE)	Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0	—	2013	2013
MSM8625Q[38]								Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM)
MSM8210[38][39]		28 nm (TSMC 28LP)	2 cores up to 1.2 GHz Cortex-A7	Adreno 302 400 MHz (12.8 GFLOPS in FP32)	Hexagon QDSP6			Gobi 3G (UMTS; GSM)
MSM8610[38][39]								Gobi 3G (CDMA/UMTS; GSM)
MSM8212[38][39]			4 cores up to 1.2 GHz Cortex-A7					Gobi 3G (UMTS; GSM)
MSM8612[38][39]								Gobi 3G (CDMA/UMTS; GSM)
MSM8905[40]	Qualcomm 205		2 cores up to 1.1 GHz Cortex-A7	Adreno 304 400 MHz (19.2 GFLOPS in FP32)	Hexagon 536	Up to 3 MP single camera	LPDDR2/3 Single-channel 384 MHz	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.1 + BLE, 802.11n (2.4 GHz)	4.0	March 20, 2017[41]	2017
MSM8208[42]	Snapdragon 208					Up to 5 MP single camera	LPDDR2/3 Single-channel 400 MHz	Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM)		2.0	September 9, 2014[43]	2014
MSM8909[44]	Snapdragon 210		4 cores up to 1.1 GHz Cortex-A7			Up to 8 MP single camera	LPDDR2/3 Single-channel 533 MHz	X5 LTE
MSM8909AA[45]	Snapdragon 212		4 cores up to 1.3 GHz Cortex-A7								July 28, 2015[46]	2015
QM215[47]	Qualcomm 215		4 cores up to 1.3 GHz Cortex-A53	Adreno 308 485 MHz (23.3 GFLOPS in FP32)	Hexagon	Up to 13 MP single camera / 8 MP dual camera	LPDDR3 Single-channel 672 MHz 3 GB	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0	1.0	July 9, 2019[48]	Q3 2019

The Snapdragon 4 series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 series, which were aimed at ultra-budget segment. Similar to the 2 series, it is the successor of the S4 Play.

Model number	Product name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement date	Sampling availability
APQ8026[49]	Snapdragon 400	28 nm (TSMC 28LP)	4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2	Adreno 305 400 MHz (19.2 GFLOPS in FP32)	Hexagon QDSP6	Up to 13.5 MP single camera	LPDDR2/3 Single-channel 533 MHz	—	Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS	1.0	2013	2013
MSM8226[49]								Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE)
MSM8626[49]								Gobi 3G (CDMA/UMTS)
MSM8926[49]								Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
APQ8028[49]			4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2	Adreno 305 450 MHz (21.6 GFLOPS in FP32)				—
MSM8228[49]								Gobi 3G (UMTS)
MSM8628[49]								Gobi 3G (CDMA/UMTS)
MSM8928[49]								Gobi 4G (LTE Cat 4)
MSM8230[49]			2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2	Adreno 305 400 MHz (19.2 GFLOPS in FP32)			LPDDR2 Single-channel 533 MHz	Gobi 3G (UMTS)
MSM8630[49]								Gobi 3G (CDMA/UMTS)
MSM8930[49]								Gobi 4G (LTE Cat 4)
MSM8930AA[49]			2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2					Gobi 4G (LTE Cat 4)
APQ8030AB[49]			2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2	Adreno 305 450 MHz (21.6 GFLOPS in FP32)				—
MSM8230AB[49]								Gobi 3G (UMTS)
MSM8630AB[49]								Gobi 3G (CDMA/UMTS)
MSM8930AB[49]								Gobi 4G (LTE Cat 4)
APQ8016	Snapdragon 410	28 nm (TSMC 28LP) / 28 nm (SMIC)	4 cores up to 1.2 GHz Cortex-A53	Adreno 306 400/450 MHz (19.2/21.6 GFLOPS in FP32)	Hexagon QDSP6 V5		LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s)	—	Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou	2.0	December 9, 2013[50][51]	H1 2014
MSM8916[52]								X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8916 v2[53]	Snapdragon 412	28 nm (TSMC 28LP)	4 cores up to 1.4 GHz Cortex-A53	Adreno 306 450 MHz (21.6 GFLOPS in FP32)			LPDDR2/3 Single-channel 32-bit 600 MHz (4.8 GB/s)				July 28, 2015[46]	H2 2015
MSM8929[54]	Snapdragon 415		4 + 4 cores (1.4 GHz + 1.0 GHz Cortex-A53)	Adreno 405 465 MHz (44.6 GFLOPS in FP32)	Hexagon V50	Up to 13 MP single camera	LPDDR3 Single-channel 32-bit 667 MHz (5.3 GB/s)		Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS		February 18, 2015[55]	H1 2015
MSM8917[56]	Snapdragon 425		4 cores up to 1.4 GHz Cortex-A53	Adreno 308 598 MHz (28.7 GFLOPS in FP32)	Hexagon 536	Up to 16 MP single camera		X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s)	Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C		February 11, 2016[57]	Q3 2016
MSM8920[58]	Snapdragon 427							X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)		3.0	October 18, 2016[59][60]	Q1 2017
MSM8937[61]	Snapdragon 430		4 + 4 cores (1.4 GHz + 1.1 GHz Cortex-A53)	Adreno 505 450 MHz (43.2 GFLOPS in FP32)		Up to 21 MP single camera	LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s)	X6 LTE			September 15, 2015[62]	Q2 2016
MSM8940[63]	Snapdragon 435							X9 LTE			February 11, 2016[57]	Q4 2016
SDM429[64]	Snapdragon 429	12 nm (TSMC 12FFC)	4 cores up to 2.0 GHz Cortex-A53	Adreno 504 320 MHz (30.7 GFLOPS in FP32)	Hexagon 536	Up to 16 MP single camera / 8 MP dual camera		X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s)	Bluetooth 5, 802.11ac Wi-Fi up to 433 Mbit/s, USB 2.0		June 26, 2018[65]	Q3 2018
SDM439[66]	Snapdragon 439		4 + 4 cores (2.0 GHz + 1.45 GHz Cortex-A53)	Adreno 505 650 MHz (62.4 GFLOPS in FP32)		Up to 21 MP single camera / 8 MP dual camera
SDM450[67]	Snapdragon 450	14 nm (Samsung 14LPP)	8 cores up to 1.8 GHz Cortex-A53	Adreno 505 600 MHz (57.6 GFLOPS in FP32)	Hexagon 546	Up to 24 MP single camera / 13 MP dual camera	LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0		June 28, 2017[68]	Q3 2017
SM4250-AA[69]	Snapdragon 460	11 nm (Samsung 11LPP)	4 + 4 cores (1.8 GHz Kryo 240 Gold – Cortex-A73 + 1.6 GHz Kryo 240 Silver – Cortex-A53)	Adreno 610 600 MHz (153.6 GFLOPS in FP32)	Hexagon 683	Spectra 340 (48 MP single camera / 16 MP dual camera)	LPDDR3 up to 933 MHz or LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C		January 20, 2020[70]	Q1 2020
SM4350[71]	Snapdragon 480	8 nm (Samsung 8LPP)	2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.8 GHz Kryo 460 Silver – Cortex-A55)	Adreno 619 650 MHz (332.8 GFLOPS in FP32)	Hexagon 686 (3.3 TOPS)	Spectra 345 (64 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL)	LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s)	Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB C	4+	January 4, 2021[72]	H1 2021
SM4350-AC[73]	Snapdragon 480+		2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.9 GHz Kryo 460 Silver – Cortex-A55)						FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C		October 26, 2021[74]	Q4 2021

Model number	Product name	Fab	CPU (Cores / Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
SM4375[75]	Snapdragon 4 Gen 1	6 nm (TSMC N6)	Kryo 2 + 6 cores (2.0 GHz Cortex-A78 + 1.8 GHz Cortex-A55)	Adreno 619 700 MHz (358.4 GFLOPS in FP32)	Hexagon	Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB 3.1	4+	September 6, 2022[76]	Q3 2022
SM4450[77]	Snapdragon 4 Gen 2	4 nm (Samsung 4LPX)	Kryo 2 + 6 cores (2.2 GHz Cortex-A78 + 1.95 GHz Cortex-A55)	Adreno 613 955 MHz (244.5 GFLOPS in FP32)	—	Spectra (108 MP single camera / 16 MP dual camera with ZSL)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal X61 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s)	Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 Gen 1		June 26, 2023[78]	Q2 2023
	Snapdragon 4 Gen 2 Accelerated Edition[a]		Kryo 2 + 6 cores (2.3 GHz Cortex-A78 + 1.95 GHz Cortex-A55)	Adreno 613 1010 MHz (258.6 GFLOPS in FP32)							May 17, 2024[79]	Q2 2024
SM4635[80]	Snapdragon 4s Gen 2		Kryo 2 + 6 cores (2.0 GHz Cortex-A78 + 1.8 GHz Cortex-A55)	Adreno 611		Spectra (84 MP single camera / 16 MP dual camera with ZSL)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	Internal (5G NR Sub-6: download up to 1 Gbit/s)			July 30, 2024[81]	Q3 2024

The Snapdragon 6 series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon line-up, appearing in mainstream devices of various manufacturers.

Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro. The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series became a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.

Model number	Product name	Fab	CPU (Cores/Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
APQ8064-1AA (DEB/FLO)	Snapdragon 600 (Advertised as S4 Pro)	28 nm (TSMC 28LP)	4 cores up to 1.5 GHz Krait 300	Adreno 320 400 MHz (76.8 GFLOPS in FP32)	Hexagon QDSP6 V4 500 MHz	Up to 21 MP single camera; Video Capture: 1080p@30fps	DDR3L-1600 (12.8 GB/s)	External	Bluetooth 4.0, Wi-Fi 802.11ac (2.4/5 GHz), IZat Gen8A	1.0	January 8, 2013[82]	Q1 2013
APQ8064M	Snapdragon 600[83]		4 cores up to 1.7 GHz Krait 300				LPDDR3 Dual-channel 32-bit (64-bit) 533 MHz (8.6 GB/s)
APQ8064T	Snapdragon 600[83]						LPDDR3 Dual-channel 32-bit (64-bit) 600 MHz (9.6 GB/s)
APQ8064AB	Snapdragon 600[83]		4 cores up to 1.9 GHz Krait 300	Adreno 320 450 MHz (86.4 GFLOPS in FP32)
MSM8936	Snapdragon 610[84]		4 cores up to 1.7 GHz Cortex-A53	Adreno 405 550 MHz (52.8 GFLOPS in FP32)	Hexagon V50 700 MHz		LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s)	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.0, Qualcomm VIVE, Wi-Fi 802.11ac, NFC, GPS, Glonass, BeiDou	2.0	February 24, 2014[85][86]	Q3 2014
MSM8939	Snapdragon 615[87]		4 + 4 cores (1.7 GHz +  1.1 GHz) Cortex-A53
MSM8939 v2	Snapdragon 616[88]		4 + 4 cores (1.7 GHz +  1.2 GHz) Cortex-A53								July 31, 2015[89]	Q3 2015
MSM8952	Snapdragon 617[90]		4 + 4 cores (1.5 GHz +  1.2 GHz) Cortex-A53		Hexagon 546		LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)	X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s)	Bluetooth 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C; USB 2.0	3.0	September 15, 2015[62]	Q4 2015
MSM8953	Snapdragon 625[91]	14 nm (Samsung 14LPP)	8 cores up to 2.0 GHz Cortex-A53	Adreno 506 650 MHz (62.4 GFLOPS in FP32)		Up to 24 MP single camera; Video Capture: 4K@30fps		X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1, NFC, VIVE 1-stream Wi-Fi 802.11ac MU-MIMO, IZat Gen8C; USB 3.0		February 11, 2016[92]	Q2 2016
MSM8953 Pro	Snapdragon 626[93]		8 cores up to 2.2 GHz Cortex-A53								October 18, 2016[94]	Q4 2016
SDM630	Snapdragon 630[95][96][97]		4 + 4 cores (2.2 GHz +  1.8 GHz) Cortex-A53)	Adreno 508 650 MHz (124.8 GFLOPS in FP32)	Hexagon 642	Spectra 160 (24 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps)	LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.66 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, 802.11ac Wi-Fi 1x1, NFC, USB 3.1	4.0	May 8, 2017[98]	Q2 2017
SDM632	Snapdragon 632[99]		4 + 4 cores (1.8 GHz Kryo 250 Gold – Cortex-A73 + 1.8 GHz Kryo 250 Silver – Cortex-A53)	Adreno 506 725 MHz (69.6 GFLOPS in FP32)	Hexagon 546	Up to 40 MP single camera, 13 MP dual camera; Video Capture: 4K@30fps	LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)		3.0	June 26, 2018[65]	Q3 2018
SDM636	Snapdragon 636[100]		4 + 4 cores (1.8 GHz Kryo 260 Gold – Cortex-A73 + 1.6 GHz Kryo 260 Silver – Cortex-A53)	Adreno 509 430 MHz (110.1 GFLOPS in FP32)	Hexagon 680	Spectra 160 (24 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)	LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.7 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)		4.0	October 17, 2017[101]	Q4 2017
MSM8956	Snapdragon 650[102]	28 nm (TSMC 28HPM)	2 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)	Adreno 510 600 MHz (153.6 GFLOPS in FP32)	Hexagon V56	Up to 21 MP single camera; Video Capture: 4K@30fps	LPDDR3 Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s)	X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s)	Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0	3.0	February 18, 2015[55][103]	Q1 2016
MSM8976	Snapdragon 652[104]		4 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)
MSM8976 Pro	Snapdragon 653[105]		4 + 4 cores (1.95 GHz Cortex-A72 + 1.4 GHz Cortex-A53)	Adreno 510 621 MHz (159 GFLOPS in FP32)				X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)			October 18, 2016[59][60]	Q4 2016
SDM660	Snapdragon 660[106]	14 nm (Samsung 14LPP)	4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 + 1.84 GHz Kryo 260 Silver – Cortex-A53)	Adreno 512 647 MHz (165.6 GFLOPS in FP32)	Hexagon 680	Spectra 160 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)	LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, 802.11ac Wi-Fi, NFC, USB 3.1	4.0	May 8, 2017[98]	Q2 2017
SDA660	Snapdragon 660[107]							Internal: no
SM6115	Snapdragon 662[108]	11 nm (Samsung 11LPP)	4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 + 1.8 GHz Kryo 260 Silver – Cortex-A53)	Adreno 610 950 MHz (243.2 GFLOPS in FP32)	Hexagon 683	Spectra 340T (48 MP single camera / 13 MP dual camera; Video Capture: 1080p@60fps)	LPDDR3 933 MHz LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C	3.0	January 20, 2020[70]	Q1 2020
SM6125	Snapdragon 665[109]				Hexagon 686 (3.3 TOPS)	Spectra 165 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)		X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.1, Wi-Fi 802.11ac, NFC, USB 3.1		April 9, 2019[110][111]	Q2 2019
SDM670	Snapdragon 670[112]	10 nm (Samsung 10LPP)	2 + 6 cores (2.0 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55)	Adreno 615 430 MHz (220.2 GFLOPS in FP32)	Hexagon 685 (3 TOPS)	Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)	LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)		Bluetooth 5, 802.11ac Wi-Fi, NFC, USB 3.1	4+	August 8, 2018[113]	Q3 2018
SM6150	Snapdragon 675[114]	11 nm (Samsung 11LPP)	2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55)	Adreno 612 845 MHz (216.3 GFLOPS in FP32)		Spectra 250L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)					October 22, 2018[115]	Q1 2019
SM6150- AC	Snapdragon 678[116]		2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55)	Adreno 612 895 MHz (229.1 GFLOPS in FP32)							December 15, 2020[117]	Q4 2020
SM6225	Snapdragon 680[118]	6 nm (TSMC N6)	4 + 4 cores (2.4 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53)	Adreno 610 1114 MHz (285.2 GFLOPS in FP32)	Hexagon 686 (3.3 TOPS)	Spectra 346 (64 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11ac Wave 2, NFC, NavIC, USB C	3.0	October 26, 2021[74]	Q4 2021
SM6225- AD	Snapdragon 685[119]		4 + 4 cores (2.8 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53)	Adreno 610 1260 MHz (322.6 GFLOPS in FP32)		Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps)			FastConnect 6200, Bluetooth 5.2, Wi-Fi 802.1ac 1x1, USB 3.1		March 23, 2023	Q1 2023
SM6350	Snapdragon 690[120]	8 nm (Samsung 8LPP)	2 + 6 cores (2.0 GHz Kryo 560 Gold – Cortex-A77 + 1.7 GHz Kryo 560 Silver – Cortex-A55)	Adreno 619L 565 MHz (289.3 GFLOPS in FP32)	Hexagon 692 (5 TOPS)	Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.1, 802.11ac/ax 2x2 (MU-MIMO), NFC, USB 3.1	4+	June 16, 2020[121]	H2 2020
SM6375	Snapdragon 695[122]	6 nm (TSMC N6)	2 + 6 cores (2.2 GHz Kryo 660 Gold – Cortex-A78 + 1.8 GHz Kryo 660 Silver – Cortex-A55)	Adreno 619 840 MHz (430.1 GFLOPS in FP32)	Hexagon 686 (3.3 TOPS)	Spectra 346T (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, 802.11ac 2x2 (MU-MIMO), NFC, USB C		October 26, 2021[74]	Q4 2021

Model number	Product  name	Fab	CPU (Cores / Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
SM6450[123]	Snapdragon 6 Gen 1	4 nm (Samsung 4LPX)	Kryo 4 + 4 cores (2.2 GHz Cortex-A78 + 1.8 GHz Cortex-A55)	Adreno 710 676 MHz (346.1 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 25+16 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	September 6, 2022[76]	Q1 2023
SM6115-AC[124]	Snapdragon 6s Gen 1	11 nm (Samsung 11LPP)	Kryo 4 + 4 cores (2.1 GHz Cortex-A73 + 2.0 GHz Cortex-A53)	Adreno 610 1050 MHz (268.8 GFLOPS in FP32)	Hexagon	Spectra (48 MP single camera / 13 MP dual camera with ZSL; Video Capture: 1080p@60fps)	LPDDR3 up to 933 MHz / LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, USB C	3.0	August 9, 2024[125]	Q3 2024
SM6475-AB[126]	Snapdragon 6 Gen 3	4 nm (Samsung 4LPX)	Kryo 4 + 4 cores (2.4 GHz Cortex-A78 + 1.8 GHz Cortex-A55)	Adreno 710 940 MHz (481.3 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	August 31, 2024[127]	Q3 2024
SM6375-AC[128]	Snapdragon 6s Gen 3	6 nm (TSMC N6)	Kryo 2 + 6 cores (2.3 GHz Cortex-A78 + 2.0 GHz Cortex-A55)	Adreno 619 900 MHz (460.8 GFLOPS in FP32)	Hexagon	Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C		June 6, 2024[129]	Q2 2024
SM6650[130]	Snapdragon 6 Gen 4	4 nm (TSMC N4P)	Kryo (1× 2.3 GHz Cortex-A720 + 3× 2.2 GHz Cortex-A720 + 4× 1.8 GHz Cortex-A520)	Adreno 810 895 MHz (458.2 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		February 12, 2025[131]	Q1 2025

On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.^[132]

Model number	Product name	Fab	CPU (ARMv8.2)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
SDM710[133]	Snapdragon 710	10 nm (Samsung 10LPP)	2 + 6 cores (2.2 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55)	Adreno 616 504 MHz (258 GFLOPS in FP32)	Hexagon 685 (3 TOPS)	Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)	LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.0; NFC; 802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	4	May 23, 2018[134]	Q2 2018
SDM712[135]	Snapdragon 712		2 + 6 cores (2.3 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55)	Adreno 616 610 MHz (312.3 GFLOPS in FP32)						4+	February 6, 2019[136]	Q1 2019
SM7125[137]	Snapdragon 720G	8 nm (Samsung 8LPP)	2 + 6 cores (2.3 GHz Kryo 465 Gold – Cortex-A76 + 1.8 GHz Kryo 465 Silver – Cortex-A55)	Adreno 618 750 MHz (384 GFLOPS in FP32)	Hexagon 692 (5 TOPS)	Spectra 350L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)			FastConnect 6200; Bluetooth 5.1; NFC; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1		January 20, 2020[70]	Q1 2020
SM7150-AA[138]	Snapdragon 730		2 + 6 cores (2.2 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55)	Adreno 618 610 MHz (312.3 GFLOPS in FP32)	Hexagon 688 (3.6 TOPs)	Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)			FastConnect 6200; Bluetooth 5.0; NFC; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		April 9, 2019[110][139]	Q2 2019
SM7150-AB[140]	Snapdragon 730G			Adreno 618 700 MHz (358.4 GFLOPS in FP32)
SM7150-AC[141]	Snapdragon 732G		2 + 6 cores (2.3 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55)	Adreno 618 800 MHz (409.6 GFLOPS in FP32)					FastConnect 6200; Bluetooth 5.1; NFC; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		August 31, 2020[142]	Q3 2020
SM7225[143]	Snapdragon 750G		2 + 6 cores (2.2 GHz Kryo 570 Gold – Cortex-A77 + 1.8 GHz Kryo 570 Silver – Cortex-A55)	Adreno 619 800 MHz (409.6 GFLOPS in FP32)	Hexagon 694 (4.7 TOPs)	Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s)	Internal X52 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6200; Bluetooth 5.1; NFC; 802.11ac/ax-ready 2x2 (MU-MIMO); GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		September 22, 2020[144]	Q4 2020
SM7250-AA[145]	Snapdragon 765	7 nm (Samsung 7LPP)	1x 2.3 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55)	Adreno 620 540 MHz (414.7 GFLOPS in FP32)	Hexagon 696 (5.4 TOPs)	Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)			FastConnect 6200; Bluetooth 5.0; NFC; 802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		December 4, 2019[146][147]	Q1 2020
SM7250-AB[148]	Snapdragon 765G		1x 2.4 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55)	Adreno 620 625 MHz (480 GFLOPS in FP32)
SM7250-AC[149]	Snapdragon 768G		1x 2.8 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.4 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55)	Adreno 620 750 MHz (576 GFLOPS in FP32)					FastConnect 6200; Bluetooth 5.2; NFC; 802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		May 10, 2020[150]	Q2 2020
SM7325[151]	Snapdragon 778G	6 nm (TSMC N6)	1x 2.4 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642L 550 MHz (563.2 GFLOPS in FP32)	Hexagon 770 (12 TOPs)	Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		May 19, 2021[152]	Q2 2021
SM7325-AE[153]	Snapdragon 778G+		1x 2.5 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642L 608 MHz (622.6 GFLOPS in FP32)							October 26, 2021[74]	Q4 2021
SM7350-AB[154]	Snapdragon 780G	5 nm (Samsung 5LPE)	1x 2.4 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642 490 MHz (752.6 GFLOPS in FP32)		Spectra 570 (192 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	Internal: X53 5G (5G NR Sub-6: download up to 3.3 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6900; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		March 25, 2021[155]	Q1 2021
SM7325-AF[156]	Snapdragon 782G	6 nm (TSMC N6)	1x 2.7 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642L 719 MHz (736.3 GFLOPS in FP32)		Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		November 23, 2022[157]	Q4 2022

Model number	Product name	Fab	CPU (Cores / Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
SM7450-AB[158]	Snapdragon 7 Gen 1	4 nm (Samsung 4LPX)	Kryo (1× 2.4 GHz {2.5 GHz Accelerated Edition} Cortex-A710 + 3× 2.36 GHz Cortex-A710 + 4× 1.8 GHz Cortex-A510)	Adreno 644 443 MHz (680.4 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	May 20, 2022[159]	Q2 2022
SM7475-AB[160]	Snapdragon 7+ Gen 2	4 nm (TSMC N4)	Kryo (1× 2.91 GHz Cortex-X2 + 3× 2.49 GHz Cortex-A710 + 4× 1.8 GHz Cortex-A510)	Adreno 725 580 MHz (1187.8 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 32 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)			FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	March 17, 2023[161]	Q1 2023
SM7435-AB[162]	Snapdragon 7s Gen 2	4 nm (Samsung 4LPX)	Kryo 4 + 4 cores (2.4 GHz Cortex-A78 + 1.95 GHz Cortex-A55)	Adreno 710 940 MHz (481.3 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	September 15, 2023[163]	Q3 2023
SM7550-AB[164]	Snapdragon 7 Gen 3	4 nm (TSMC N4P)	Kryo (1× 2.63 GHz Cortex-A715 + 3× 2.4 GHz Cortex-A715 + 4× 1.8 GHz Cortex-A510)	Adreno 720 975 MHz (998.4 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)		Internal: X63 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s, upload up to 3.5 Gbit/s)	FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	November 17, 2023[165]	Q4 2023
SM7675-AB[166]	Snapdragon 7+ Gen 3		Kryo (1× 2.8 GHz Cortex-X4 + 4× 2.6 GHz Cortex-A720 + 3× 1.9 GHz Cortex-A520)	Adreno 732 950 MHz (1459.2 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 36 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)	LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)		FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		March 21, 2024[167]	Q1 2024
SM7635[168]	Snapdragon 7s Gen 3		Kryo (1× 2.5 GHz Cortex-A720 + 3× 2.4 GHz Cortex-A720 + 4× 1.8 GHz Cortex-A520)	Adreno 810 1050 MHz (537.6 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	August 20, 2024[169]	Q3 2024

The Snapdragon 8 series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

Model number	Product name	Fab	Die size	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
APQ8074AA	Snapdragon 800[170]	28 nm (TSMC 28HPM)	118 mm2	4 cores 2.26 GHz Krait 400; 4 KiB + 4 KiB L0 cache, 16 KiB + 16 KiB L1 cache and 2 MiB L2 cache	Adreno 330 450 MHz (115.2 GFLOPS in FP32)	Hexagon QDSP6 V5 600 MHz	21 MP single camera (Video capture: 4K@30fps)	LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)	—	Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B	2.0	January 8, 2013[82]	Q2 2013
MSM8274AA									Gobi 3G (UMTS)[82]
MSM8674AA									Gobi 3G (CDMA, UMTS)
MSM8974AA									Gobi 4G (LTE Cat 4: download 150 Mbit/s, upload 50 Mbit/s
MSM8974AA v3	Snapdragon 801[171]								Gobi 4G (LTE Cat 4)			February 24, 2014[172][171]	Q3 2014
APQ8074AB v3				4 cores 2.36 GHz Krait 400	Adreno 330 578 MHz[173] (150 GFLOPS in FP32)			LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	—				Q4 2013
MSM8274AB	Snapdragon 800[170]		118 mm2						Gobi 3G (UMTS)[174]			January 8, 2013[82]	Q4 2013
MSM8674AB v3	Snapdragon 801[171]								Gobi 3G (CDMA, UMTS)[82]			February 24, 2014[172][171]	Q2 2013
MSM8974AB v3									Gobi 4G (LTE Cat 4)				Q4 2013
MSM8274AC v3				4 cores 2.45 GHz[175] Krait 400[176]					Gobi 3G (UMTS)[82]				Q2 2014
MSM8974AC v3									Gobi 4G (LTE Cat 4)[82]				Q1 2014
APQ8084	Snapdragon 805[177]			4 cores 2.7 GHz Krait 450	Adreno 420 600 MHz (153.6 GFLOPS in FP32)	Hexagon V50 800 MHz	55 MP single camera (Video capture: 4K@30fps)	LPDDR3 Dual-channel 64-bit 800 MHz (25.6 GB/s)	External	Bluetooth 4.1 802.11ac (2.4/5 GHz) IZat Gen8B		November 20, 2013[178]	Q1 2014
MSM8992	Snapdragon 808[179][180]	20 nm (TSMC)		2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53) [181]	Adreno 418 600 MHz [182] (153.6 GFLOPS in FP32)	Hexagon V56 800 MHz	Up to 21 MP single camera (Video capture: 4K@30fps)	LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	X10 LTE (Cat 9: download 450 Mbit/s, upload 50 Mbit/s) [183]	Bluetooth 4.1 802.11ac IZat Gen8C[184]		April 7, 2014[185]	Q3 2014
MSM8994 v1[186][180]	Snapdragon 810			4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53)[187]	Adreno 430 600 MHz (230.4 GFLOPS in FP32)		55 MP single camera (Video capture: 4K@30fps)	LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)
MSM8994 v2[188]					Adreno 430 630 MHz (241.9 GFLOPS in FP32)								2015
MSM8994 v2.1[189]													Q2 2015
MSM8996 Lite	Snapdragon 820[190]	14 nm FinFET (Samsung 14LPP)	113.7 mm2 [191]	2 + 2 cores Kryo (1.8 GHz + 1.36 GHz)	Adreno 530 510 MHz (261.1 GFLOPS in FP32)	Hexagon 680 1.0 GHz	Spectra (28 MP Photo Capture / 25 MP at 30fps single camera with ZSL / 13 MP Dual Camera with ZSL; Video capture: 4K@30fps)	LPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s)	X12 LTE (download: Cat 12, 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, 150 Mbit/s; 2x20 MHz CA; 64-QAM.)	Bluetooth 4.1 802.11ac IZat Gen8C	3.0	March 2, 2015[192][193][194]	Q1 2016
MSM8996				2 + 2 cores Kryo (2.15 GHz + 1.593 GHz)	Adreno 530 624 MHz (319.5 GFLOPS in FP32)			LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)					Q4 2015
MSM8996 Pro-AB	Snapdragon 821[195][196][197]											July 11, 2016[198]	Q3 2016
MSM8996 Pro-AC				2 + 2 cores Kryo (2.342 GHz + 1.6/2.188 GHz)	Adreno 530 653 MHz (334.3 GFLOPS in FP32)
MSM8998	Snapdragon 835[199]	10 nm FinFET (Samsung 10LPE)	72.3 mm2[191]	4 + 4 cores Kryo 280 (2.45 GHz Cortex-A73 + 1.9 GHz Cortex-A53)	Adreno 540 670/710 MHz (343/363.5 GFLOPS in FP32)	Hexagon 682	Spectra 180 (32 MP Photo capture / 25 MP at 30fps single camera with ZSL / 16 MP Dual Camera with ZSL; Video capture: 4K@30fps)	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s)	X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.0; 802.11ac/ad; GPS, Glonass, Beidou, Galileo, QZSS, SBAS	4.0	November 17, 2016[200]	Q2 2017[201]
SDM845	Snapdragon 845[202]	10 nm FinFET (Samsung 10LPP)	95.0 mm2[191]	4 + 4 cores Kryo 385 (2.8 GHz Cortex-A75 + 1.8 GHz Cortex-A55)	Adreno 630 710 MHz (727 GFLOPS in FP32)	Hexagon 685 (3 TOPs)	Spectra 280 (192 MP Photo capture / 48 MP single camera with MFNR / 32 MP at 30fps single camera with MFNR/ZSL / 16 MP at 60fps single camera with MFNR/ZSL / 16 MP at 30fps Dual Camera with MFNR/ZSL; Video capture: 4K@60fps)		X20 LTE (download: Cat 18, @ 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, @ 150 Mbit/s; 2x20 MHz CA; 64-QAM)		4+	December 7, 2017[203][204]	Q1 2018
SM8150	Snapdragon 855[205]	7 nm (TSMC N7)	76.9 mm2[191]	1 + 3 + 4 cores Kryo 485 (2.84 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.8 GHz Cortex-A55)	Adreno 640 585 MHz (898.6 GFLOPS in FP32)	Hexagon 690 (7 TOPs)	Spectra 380 (192 MP single camera / 48 MP at 30 fps single camera with MFNR/ZSL / 22 MP at 30 fps dual camera with MFNR/ZSL; Video capture: 4K@60fps HDR)	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)	Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External: X50 5G[206] (5G NR Sub-6 & mmWave: download up to 5 Gbit/s)	Bluetooth 5.0; 802.11ax (Wi-Fi 6); GPS, Glonass, Beidou, Galileo, QZSS, SBAS; USB 3.1		December 5, 2018[207][208]	Q1 2019
SM8150-AC	Snapdragon 855+[209]			1 + 3 + 4 cores Kryo 485 (2.96 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.80 GHz Cortex-A55)	Adreno 640 675 MHz (1036.8 GFLOPS in FP32)							July 15, 2019[210]	Q3 2019
	Snapdragon 860											March 22, 2021[211]	Q1 2021
SM8150P	Snapdragon 855+								Internal: no + External: X55 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)			July 15, 2019[210]	Q3 2019
SM8250	Snapdragon 865[212]	7 nm (TSMC N7P)	86.8 mm2[191]	1 + 3 + 4 cores Kryo 585 (2.84 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)	Adreno 650 587 MHz (901.6 GFLOPS in FP32)	Hexagon 698 (15 TOPs)	Spectra 480 (200 MP Photo Capture / 64 MP at 30 fps single camera with MFNR/ZSL / 25 MP at 30 fps dual camera with MFNR/ZSL; Video capture: 8K@30fps, 4K@120fps HDR)	LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)	Internal: none + External: X55 5G[213] (5G NR Sub-6 & mmWave: download @ 7.5 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)	FastConnect 6800: Bluetooth 5.1; 802.11ax (Wi-Fi 6) @ 1.774 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		December 4, 2019[214]	Q1 2020
SM8250-AB	Snapdragon 865+[215]			1 + 3 + 4 cores Kryo 585 (3.1 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)	Adreno 650 670 MHz (1029.1 GFLOPS in FP32)					FastConnect 6900: Bluetooth 5.2; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		July 8, 2020[216]	Q3 2020
SM8250-AC	Snapdragon 870[217]			1 + 3 + 4 cores Kryo 585 (3.2 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)						FastConnect 6800 Bluetooth 5.2[218] 802.11ax (Wi-Fi 6) @ 1.774 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		January 19, 2021[219]	Q1 2021
SM8350	Snapdragon 888[220]	5 nm (Samsung 5LPE)	112.2 mm2[191]	1 + 3 + 4 cores Kryo 680 (2.84 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55)	Adreno 660 840 MHz (1290.2 GFLOPS in FP32)	Hexagon 780 (26 TOPs)	Spectra 580 (200 MP Photo Capture; 84 MP single camera @ 30 fps MFNR/ZSL, 64 MP dual camera @ 30fps ZSL, 28 MP triple camera @ 30fps ZSL; Video Capture: 8K@30fps, 4K@120fps HDR)	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)	Internal: X60 5G (5G NR Sub-6 & mmWave: download 7.5 Gbit/s, upload 3 Gbit/s; LTE Cat 22: download 2.5 Gbit/s, upload 0.316 Gbit/s)	FastConnect 6900: Bluetooth 5.2 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	December 1, 2020[221][222][223][224]	Q1 2021
SM8350-AC	Snapdragon 888+[225]			1 + 3 + 4 cores Kryo 680 (3.0 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55)		Hexagon 780 (32 TOPs)						June 28, 2021[226]	Q3 2021

Model number	Product name	Fab	Die size	CPU (ARMv9) (Cores / Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Released
SM8450	Snapdragon 8 Gen 1[227]	4 nm (Samsung 4LPX)	128.5 mm2[191]	Kryo (1x 3.0 GHz Cortex-X2 + 3x 2.5 GHz Cortex-A710 + 4x 1.8 GHz Cortex-A510)	Adreno 730 818 MHz (1675.3 GFLOPs in FP32)	Hexagon	Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR)	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)	Internal: X65 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)	FastConnect 6900: Bluetooth 5.3; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	November 30, 2021[228]	Q4 2021
SM8475	Snapdragon 8+ Gen 1[229]	4 nm (TSMC N4)	102.6 mm2[191]		Adreno 730 900 MHz (1843.2 GFLOPS in FP32)							May 20, 2022[159]	Q4 2022
				Kryo (1x 3.2 GHz Cortex-X2 + 3x 2.75 GHz Cortex-A710 + 4x 2.0 GHz Cortex-A510)									Q2 2022
SM8425	Snapdragon 8+ Gen 1 4G								Internal: (LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)				Q3 2022
SM8550-AB	Snapdragon 8 Gen 2[230]	4 nm (TSMC N4)	118.4 mm2 [191]	Kryo (1× 3.19 GHz Cortex-X3 + 4× 2.8 GHz {2×Cortex-A715, 2×Cortex-A710} + 3× 2.0 GHz Cortex-A510)	Adreno 740 680 MHz (2089 GFLOPS in FP32)			LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)	Internal: X70 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s)	FastConnect 7800: Bluetooth 5.3; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1[231] or FastConnect 6900: Bluetooth 5.3; 802.11ac/ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1[232][233]		November 15, 2022[234]	Q4 2022
SM8550-AC	Snapdragon 8 Gen 2 for Galaxy[a]			Kryo (1× 3.36 GHz Cortex-X3 + 4× 2.8 GHz {2×Cortex-A715, 2×Cortex-A710} + 3× 2.0 GHz Cortex-A510)	Adreno 740 719 MHz (2208.8 GFLOPS in FP32)								Q1 2023
SM8650-AB	Snapdragon 8 Gen 3[238]	4 nm (TSMC N4P)	137.3 mm2 [191]	Kryo (1× 3.3 GHz Cortex-X4 + 3× 3.15 GHz Cortex-A720 + 2× 2.96 GHz Cortex-A720 + 2× 2.27 GHz Cortex-A520)	Adreno 750 903 MHz (2774 GFLOPS in FP32)			LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s)	Internal: X75 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3.5 Gbit/s)	FastConnect 7800: Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1		October 24, 2023[239]	Q4 2023
SM8650-AA				Kryo (1× 3.05 GHz Cortex-X4 + 5× 2.96 GHz Cortex-A720 + 2× 2.04 GHz Cortex-A520)									Q4 2024
SM8650-AC	Snapdragon 8 Gen 3 for Galaxy[b]			Kryo (1× 3.4 GHz Cortex-X4 + 3× 3.15 GHz Cortex-A720 + 2× 2.96 GHz Cortex-A720 + 2× 2.27 GHz Cortex-A520)	Adreno 750 1000 MHz (3072 GFLOPS in FP32)								Q1 2024
SM8635	Snapdragon 8s Gen 3[240]			Kryo (1× 3.0 GHz Cortex-X4 + 4× 2.8 GHz Cortex-A720 + 3× 2.0 GHz Cortex-A520)	Adreno 735 1100 MHz (1689.6 GFLOPS in FP32)		Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 4K@60fps HDR)	LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)	Internal: X70 5G (5G NR Sub-6 & mmWave: download @ 6.5 Gbit/s, upload @ 3.5 Gbit/s)			March 18, 2024[241][242]	Q1 2024
SM8750-AB	Snapdragon 8 Elite[243]	3 nm (TSMC N3E)	124.1 mm2 [191]	Oryon 2 + 6 cores (4.32 GHz Prime cores + 3.53 GHz Performance core)	Adreno 830 1100 MHz (3379.2 GFLOPS in FP32)	Hexagon	Spectra (320 MP Photo Capture, 108 MP single camera @30fps ZSL, 48 MP triple camera @30fps ZSL; Video Capture: 8K@60fps HDR)	LPDDR5X dual-channel 32-bit (64-bit) 5333.5 MHz (85.4 GB/s)	Internal: X80 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s)	FastConnect 7900: Bluetooth 6.0, 802.11ax/be (Wi-Fi 7) @ 5.8 Gbit/s, GPS, QZSS, Glonass, NavIC, Beidou, Galileo, USB 3.1	5	October 22, 2024[244]	Q4 2024
SM8750-3-AB				Oryon 2 + 5 cores (4.32 GHz Prime cores + 3.53 GHz Performance core)									Q1 2025
SM8750-AC	Snapdragon 8 Elite for Galaxy[b]			Oryon 2 + 6 cores (4.47 GHz Prime cores + 3.53 GHz Performance core)	Adreno 830 1200 MHz (3686.4 GFLOPS in FP32)
SM8735	Snapdragon 8s Gen 4[245]	4 nm (TSMC N4P)		Kryo (1× 3.2 GHz Cortex-X4 + 3× 3.0 GHz Cortex-A720 + 2× 2.8 GHz Cortex-A720 + 2× 2.02 GHz Cortex-A720)	Adreno 825 1150 MHz (2355.2 GFLOPS in FP32)		Spectra (320 MP Photo Capture, 108 MP single camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 4K@60fps HDR)	LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s)	Internal (5G NR Sub-6: download up to 4.2 Gbit/s)			April 2, 2025	Q2 2025

Model number	Product name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
MSM8998	Snapdragon 835[246]	10 nm (Samsung 10LPE)	Kryo 280 (4× 2.6 GHz + 4× 1.9 GHz)	Adreno 540 710 MHz (363.5 GFLOPS in FP32)	Hexagon 682	Spectra 180 (Up to 32 MP camera / 16 MP dual)	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)	X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5; 802.11ac/ad Wave 2 (MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS	4	December 5, 2017[203]	Q2 2018
SDM850	Snapdragon 850[247]	10 nm (Samsung 10LPP)	Kryo 385 (4× 2.96 GHz + 4× 1.77 GHz)	Adreno 630 710 MHz (727 GFLOPS in FP32)	Hexagon 685 (3 TOPS)	Spectra 280 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)	X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM)		4+	June 4, 2018[248]	Q3 2018

Model number	Product name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
SC7180	Snapdragon 7c[249]	8 nm (Samsung 8LPP)	Kryo 468 2 + 6 cores (2.4 GHz)	Adreno 618 825 MHz (422.4 GFLOPS in FP32)	Hexagon 692 (5 TOPS)	Spectra 255 (32 MP camera, 16 MP dual)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)	X15 LTE download: Cat 15, @ 800 Mbit/s; upload: Cat 13, @ 150 Mbit/s	Bluetooth 5; 802.11ax (Wi-Fi 6); GPS, Glonass, SBAS, Beidou, Galileo, QZSS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0		December 5, 2019[250]	Q1 2020
SC7180P	Snapdragon 7c Gen 2[251]		Kryo 468 2 + 6 cores (2.55 GHz)								May 24, 2021[252]	Q2 2021
SC7280	Snapdragon 7c+ Gen 3[253]	6 nm (TSMC N6)	Kryo 4 Gold + 4 Silver cores (Cortex-A78 2.4 GHz + Cortex-A55 1.8 GHz)		Hexagon (6.5 TOPS)	Spectra (64 MP single camera or 36+22 MP dual camera)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) or LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal:X53 5G/LTE (5G: download @ 3.7 Gbit/s, upload @ 2.9 Gbit/s; LTE Cat 24/22: download @ 1200 Mbit/s, upload @ 210 Mbit/s)	FastConnect 6700, Bluetooth 5.2; 802.11ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, Glonass, BeiDou, Galileo, QZSS, SBAS, USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSD		December 1, 2021[254]	Q1 2022

Model number	Product name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
SC8180	Snapdragon 8c[255]	7 nm (TSMC N7)	Kryo 490 4 + 4 cores (2.45 GHz + 1.80 GHz)	Adreno 675 590 MHz	Hexagon 690 (9 TOPS)	Spectra 390 (192MP single camera or 22MP at 30fps dual camera with MFNR / ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)	Internal: X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) External: X55 5G/LTE[213] (5G: download @ 7 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s)	Bluetooth 5.0; 802.11ac/ad; GPS, Glonass, SBAS, Beidou, Galileo, QZSS; USB 3.1; UFS 3.0, NVMe SSD	4+	December 5, 2019[250]	Q1 2020

Model number	Product name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
SC8180X	Snapdragon 8cx[256]	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (2.84 GHz Cortex-A76 + 1.80 GHz Cortex-A55)	Adreno 680 585 MHz (1797.1 GFLOPS in FP32)	Hexagon 690 (9 TOPS)	Spectra 390 (32MP single camera, 16MP at 30fps dual camera with MFNR / ZSL)[257]	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.3 GB/s)	No internal modem Optional external X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM)	Bluetooth 5.0; 802.11ac/ad; GPS, Glonass, SBAS, Beidou, Galileo, QZSS; USB 3.1; UFS 3.0, NVMe SSD	4+	December 6, 2018[258][259][260]	Q3 2019
SC8180XP	Snapdragon 8cx Gen 2 5G[261]		Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 1.8 GHz Cortex-A55)	Adreno 690 660 MHz (2027.5 GFLOPS in FP32)				No internal modem Optional external X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) or X55 5G/LTE[213] (5G: download @ 7 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s)	Bluetooth 5.1; 802.11ax (Wi-Fi 6) 2x2 (MU-MIMO) @ 2.4 Gbit/s, NFC, GPS, Glonass, Beidou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.0. NVMe SSD		September 3, 2020[262]	Q3 2020
SC8280	Snapdragon 8cx Gen 3 [263]	5 nm (Samsung 5LPE)	Kryo[264] 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)	Adreno 695 900 MHz (3686.4 GFLOPS in FP32)	Hexagon[265] (15 TOPS)	Spectra (24 MP at 30fps single camera with MFNR/ZSL)		No internal modem Optional external X55 5G/LTE, X62 5G/LTE, X65 5G/LTE (5G: download @ 4.4/7.5/10 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s)	FastConnect 6900, Bluetooth 5.1; 802.11ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, Glonass, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD		December 1, 2021[254][264][266]	Q1 2022

Product name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Announcement Date	Sampling availability
Microsoft SQ1	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (3 GHz Cortex-A76 + 1.80 GHz Cortex-A55)	Adreno 685 590 MHz (1812.5 GFLOPs in FP32)	Hexagon 690 (9 TOPS)	Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s)	No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)	Bluetooth 5.0; 802.11ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD	4+	October 2, 2019[267][268]	Q4 2019
Microsoft SQ2		Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 2.42 GHz Cortex-A55)	Adreno 690 680 MHz (2089 GFLOPs in FP32)							October 1, 2020[269]	Q4 2020
Microsoft SQ3[270][271]	5 nm (Samsung 5LPE)	Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)	Adreno 695 900 MHz (3686.4 GFLOPS in FP32)	Hexagon (15 TOPS)[272]	Spectra (24 MP at 30fps single camera with MFNR/ZSL)		No internal modem Optional external X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	FastConnect 6900, Bluetooth 5.1; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD			Q3 2022

Model number	Fab	Die size	CPU (Cores/Freq)	GPU	DSP/NPU	ISP	Memory technology	Modem	Connectivity	Announcement Date	Sampling availability
Snapdragon X[273]
X1-26-100	4 nm (TSMC N4)		Oryon 8 core (3.0 GHz)	Adreno X1-45 1107 MHz (1.7 TFLOPS)	Hexagon (45 TOPS)	Spectra (36 MP single camera)	LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)	No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD	January 6, 2025[274]	Q1 2025
Snapdragon X Plus[275][276]
X1P-42-100	4 nm (TSMC N4)		Oryon 8 core (3.2 GHz, single-core boost up to 3.4 GHz)	Adreno X1-45 1107 MHz (1.7 TFLOPS)	Hexagon (45 TOPS)	Spectra (36 MP single camera)	LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)	No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD	April 24, 2024[277]	Q2 2024
X1P-46-100			Oryon 8 core (3.4 GHz, single-core boost up to 4.0 GHz)	Adreno X1-45 (2.1 TFLOPS)
X1P-64-100		172.7 mm2	Oryon 10 core (3.4 GHz)	Adreno X1-85 1250 MHz (3.8 TFLOPS)		Spectra (64 MP single camera / 36 MP dual camera)
X1P-66-100			Oryon 10 core (3.4 GHz, single-core boost up to 4.0 GHz)
Snapdragon X Elite[278][276]
X1E-78-100	4 nm (TSMC N4)	172.7 mm2	Oryon 12 core (3.4 GHz)	Adreno X1-85 1250 MHz (3.8 TFLOPS)	Hexagon (45 TOPS)	Spectra (64 MP single camera / 36 MP dual camera)	LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)	No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	No internal External: FastConnect 7800, Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 4.0; UFS 4.0, NVMe SSD	October 24, 2023[279]	Q2 2024
X1E-80-100			Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz)
X1E-84-100			Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz)	Adreno X1-85 1500 MHz (4.6 TFLOPS)
X1E-00-1DE			Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz)

See: Qualcomm Hexagon

Model number	Product name	Fab	CPU	Co-processor	GPU	DSP	Memory technology	Modem	Connectivity	Announcement Date	Sampling availability
?	Wear 1100[280]	28 nm	1 core up to 1.2 GHz Cortex-A7 (ARMv7)	—	Fixed Function GPU		LPDDR2	Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s)	Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou	May 30, 2016[281]	Q2 2016[282]
	Wear 1200[283]		1 core up to 1.3 GHz Cortex-A7 (ARMv7)					Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s)	Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou	June 27, 2017[284]	Q2 2017[285]
MSM8909w[286]	Wear 2100[287]		4 cores up to 1.2 GHz Cortex-A7 (ARMv7)		Adreno 304	Hexagon	LPDDR3 400 MHz	X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s)	Bluetooth 4.1[a]; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou	February 10, 2016[288]	Q1 2016[289]
	Wear 2500[290]									June 26, 2018[291]	Q2 2018
	Wear 3100[292]			QCC1110 (1 core 50 MHz Cortex-M0)						September 10, 2018[293]	Q3 2018[294]
SDM429w	Wear 4100	12 nm	4 cores up to 2.0 GHz Cortex-A53 (ARMv8-A)	—	Adreno A504 320 MHz	Hexagon QDSP6 V56	1x32 bit LPDDR3 750 MHz		Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou	June 30, 2020[295]	Q2 2020[296]
	Wear 4100+[297]	12 nm + 28 nm		QCC1110 (1 core 50 MHz Cortex-M0)
SW5100	W5 Gen 1	4 nm	4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A)	—	Adreno A702 1 GHz	Hexagon DSP V66K	1x16 bit LPDDR4 2133 MHz	Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s)	Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou	July 19, 2022[298]	Q3 2022[299]
	W5+ Gen 1[300]	4 nm + 22 nm		QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55)

The Snapdragon 602A,^[301] for application in the motor industry,^[302] was announced on January 6, 2014.
The Snapdragon 820A^[303] was announced on January 6, 2016.

Snapdragon Automotive Cockpit platform SA4150P SA4155P SA6145P SA6150P SA6155 SA6155P •

SA7255P SA8145P SA8150P SA8155 SA8155P • SA8195P • SA8255P • SA8295P •

Snapdragon Ride & Ride Flex platform SA8540P SA8620P SA8650P SA8770P SA8775P SA9000P • AI Accelerator

Snapdragon Cockpit Elite Snapdragon Digital Chassis Snapdragon Ride Elite Qualcomm Oryon CPU

Product name (Model number)	Fab	CPU (Core / Freq)	GPU	DSP	Memory technology	Modem	Connectivity	Sampling availability
Snapdragon 602A[304] (APQ8064-AU)	28 nm (TSMC 28LP)	Krait 300 4 cores 1.51 GHz (ARMv7)	Adreno 320 400 MHz (76.8 GFLOPs) (2048x1536 + 1080p external display)	Hexagon QDSP6 V4 500 MHz	LPDDR3 Dual-channel 32-bit 533 MHz (8.5 GB/s)	External: Gobi MDM9615 LTE: FDD/TDD Cat3 CDMA: EV-DOrB/rA 1x UMTS: TD-SCDMA, DC-HSPA+/HSPA GSM: EDGE/GPRS	Bluetooth 4.1 + BLE Qualcomm VIVE QCA6574 802.11ac (Wi-Fi 5) 2x2 (MU-MIMO)	Q1 2014
Snapdragon 820AM[305] (APQ8096AU/ MSM8996AU)	14 nm (Samsung 14LPP)	Kryo 2 + 2 cores 2.15 GHz Gold + 1.59 GHz Silver (ARMv8)	Adreno 530 624 MHz (319.4 GFLOPs)	Hexagon 680 1.0 GHz	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)	Internal: APQ: no MSM: X12 LTE Download: Cat 12, 600 Mbit/s Upload: Cat 13, 150 Mbit/s	Bluetooth 4.1 802.11ac (Wi-Fi 5) IZat Gen8C	Q1 2016
SA6155P [306][307]	11 nm (Samsung 11LPP)	Kryo 460 2 + 6 cores (2.0 GHz Gold + 1.6 GHz Silver)	Adreno 608/612 (110 GFLOPs)	Hexagon 685 V6 DSP, Spectra 230 ISP	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	Internal: no	Bluetooth 5.0 802.11ac (Wi-Fi 5) GPS, Glonass, Beidou, Galileo, QZSS, SBAS	Q1 2019
Snapdragon 855A[308][309] (SA8155P)	7 nm (TSMC N7)	Kryo 485 1 + 3 + 4 cores 2.96 GHz Prime + 2.42 GHz Gold + 1.79 GHz Silver	Adreno 640 675 MHz (1036.8 GFLOPs)	Hexagon 690 (10 TOPS)	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)[310]	X24 LTE Modem FDD·TDD Cat.20 2Gbps/316Mbps 7·3CA / VoLTE, 3G GSM, CDMA 2000, TD-SCDMA, 2G GSM/CDMA	Bluetooth 5.0 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS	Q1 2021
SA8195P [311][312]		Kryo 495 4 + 4 cores Cortex-A76 + Cortex-A55	Adreno 680 600 MHz (1843.2 GFLOPs)	Hexagon	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)[313]	Internal: no	Bluetooth 5.0 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS
SA8255P	5 nm (Samsung 5LPE)	Kryo 4 + 4 cores 2.35 GHz Prime + 2.35 GHz Gold	Adreno 663	Hexagon	LPDDR5 Hexa-channel 16-bit (96-bit) 3200 MHz (76.8 GB/s)		Bluetooth 5.2 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS
SA8295P		Kryo 695 4 + 4 cores 2.56 GHz Cortex-X1 + 2.05 GHz Cortex-A78	Adreno 695	Hexagon (30 TOPS)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s)		Bluetooth 5.2 802.11ax (Wi-Fi 6) 2x2 (MU-MIMO) @ 1.7 Gbit/s GPS, Glonass, Beidou, Galileo, QZSS, SBAS	2023

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.^[314][315]
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.^[316]

Product name (Model number)	Fab	CPU (Cores/Freq)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
Snapdragon 410E[317] (APQ8016E)	28 nm (TSMC 28LP)	4 cores up to 1.2 GHz Cortex-A53 (ARMv8)	Adreno 306	Hexagon QDSP6 V5 691 MHz	Up to 13 MP camera	LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s)	none	Bluetooth 4.0, 802.11n, GPS
Snapdragon 600E[318] (APQ8064E)		4 cores up to 1.5 GHz Krait 300 (ARMv7)	Adreno 320 400 MHz	Hexagon QDSP6 V4 500 MHz	Up to 21 MP camera	DDR3/DDR3L Dual-channel 533 MHz		Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A
Snapdragon 800E[319] (APQ8074)	28 nm (TSMC 28HPM)	4 cores up to 2.3 GHz Krait 400 (ARMv7)	Adreno 330	Hexagon QDSP6 V5	Up to 55 MP camera	LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)		Bluetooth 4.1; 802.11n/ac (2.4/5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, JTAG; USB 3.0/2.0
Snapdragon 810E[320] (APQ8094)	20 nm (TSMC 20SoC)	4 + 4 cores 2.0 GHz Cortex-A57 + 1.55 GHz Cortex-A53 (ARMv8)	Adreno 430 650 MHz	Hexagon V56 800 MHz	Up to 55 MP camera	LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)		Bluetooth 4.1; 802.11ac; IZat Gen8C
Snapdragon 820E[321] (APQ8096)	14 nm FinFET (Samsung 14LPP)	2 + 2 cores (2.15 GHz + 1.6 GHz) Kryo (ARMv8)	Adreno 530	Hexagon 680 825 MHz	Up to 28 MP camera	LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)		Bluetooth 4.1; 802.11ac/ad; IZat Gen8C

The Qualcomm Vision Intelligence Platform^[322] was announced on April 11, 2018.^[323][324] The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
QCS603[325]	10 nm (Samsung 10LPP)	2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver)	Adreno 615 (Quad HD + 4K Ultra HD external display)	Hexagon 685	Spectra 270 (Up to 24 MP camera / 16 MP dual)	LPDDR4X 16-bit 1866 MHz	none	Bluetooth 5.0, NFC, 802.11ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1	4+
QCS605[326]		8 cores up to 2.5 GHz Kryo 300			Spectra 270 (Up to 32 MP camera / 16 MP dual)			Bluetooth 5.0, NFC, 802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017)^[327] was announced on June 14, 2017.^[328]
The Qualcomm 212 Home Hub (APQ8009)^[329] and Qualcomm 624 Home Hub (APQ8053)^[330] were announced on January 9, 2018.^[331]

The QCS400 Series was announced March 19, 2019.^[332]

Model number	Fab	CPU (Cores/Freq)	GPU	DSP	ISP	Audio	Memory technology	Modem	Connectivity	Sampling availability
APQ8009[333][327] (SDA212)[334]	28 nm (TSMC 28LP)	4 cores up to 1.3 GHz Cortex-A7 (ARMv7)	Adreno 304 (HD)	Hexagon 536	Up to 16 MP camera		LPDDR2/3 Single-channel 533 MHz	none	Bluetooth 4.2 + BLE, 802.11ac (2.4/5GHz) Wi-Fi
APQ8017[327]		4 cores up to 1.4 GHz Cortex-A53 (ARMv8)	Adreno 308 (Full HD)				LPDDR3 Single-channel 667 MHz
APQ8053[335] (SDA624)[336]	14 nm (Samsung 14LPP)	8 cores up to 1.8 GHz Cortex-A53 (ARMv8)	Adreno 506 (Full HD+)	Hexagon 546	Up to 24 MP camera, 13 MP dual		LPDDR3
QCS403[337]		Dual-core CPU	none	2x Hexagon V66		12× audio channels supported			Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4	Q1 2019
QCS404[338]		Quad-core CPU
QCS405[339]			Adreno 306 (Full HD+)
QCS407[340]						32× audio channels supported

• Snapdragon XR1 was announced in May 2018, is designed for Augmented reality, Virtual reality and mixed reality.^[341]
• Snapdragon XR2 was announced in December 2019, and is a derivative of the Snapdragon 865.^[342][343]

It is used in the Meta Quest 2, the HTC Vive Focus 3 and the Pico 4.

• Snapdragon XR2+ Gen 1 was announced on October 11, 2022,^[344] and is used in the Meta Quest Pro.
• Snapdragon XR2 Gen 2 is announced in September 2023.^[345] Qualcomm claims improved performance compared to its predecessor XR2 5G.

The SoC can handle up to 10 concurrent sensors & cameras, per-eye resolution of 3K x 3K and 12ms full-color video pass-through.^[346]

It supports Wi-Fi 7 network. It is integrated into Meta Quest 3.

• Snapdragon XR2+ Gen 2 is an overclocked version of the XR2 Gen 2.^[347]

Product name	Fab	Die size	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Tracking	Connectivity	Sampling availability
XR1[348]	10 nm (Samsung 10LPP)		4x Kryo 385 Gold + 4x Kryo 385 Silver	Adreno 615	Hexagon 685	Spectra	LPDDR4X	3DoF and 6DoF head and controller tracking	Wi-Fi 5 Bluetooth 5	Q1 2019
XR2[349]	7 nm (TSMC N7+)		1x Kryo 585 Prime (2.84 GHz) + 3x Kryo 585 Gold (2.42 GHz) + 4x Kryo 585 Silver (1.80 GHz)	Adreno 650 (up to 2x 3K displays at 90 Hz)	Hexagon 698	Spectra (input from up to 7 cameras)		Full 6DoF head and controller tracking, as well as hand and finger tracking	Wi-Fi 6 Bluetooth 5 5G	Q1 2020
XR2+ Gen 1[350]							LPDDR5		Wi-Fi 6E Bluetooth 5.2 5G	Q4 2022
XR2 Gen 2[351]	4 nm (Samsung 4LPX)[352]	115.8 mm2	4x Kryo (Cortex-A78C 2.36 GHz) + 2x Kryo (Cortex-A78C 2.05GHz)	Adreno 740 (up to 2x 3K displays at 90 Hz)	Hexagon	Spectra (input from up to 10 cameras)	LPDDR5X Quad-channel 16-bit (64-bit)		Wi-Fi 7 Bluetooth 5.3 5G	Q4 2023
XR2+ Gen 2[353]			4x Kryo (Cortex-A78C) + 2x Kryo (Cortex-A78C)	Adreno 740 (up to 2x 4.3K displays at 90 Hz)	Hexagon	Spectra (input from up to 12 cameras)				Q1 2024

The Qualcomm Snapdragon AR2 Gen 1 Platform was announced November 17, 2022.^[354] It is intended for use in smart glasses.^[355]
On September 27, 2023 Qualcomm announced the Snapdragon AR1 Gen 1 Platform for slim and light AR glasses.^[345] It is designed to enable personal assistants, audio quality enhancement, visual search, and real-time translation using on-device AI acceleration. The platform supports binocular displays with up to 1280 x 1280 resolution for heads-up information and also content consumption. The new 14-bit ISP can capture 12MP photos and 6MP video recording & live-streaming. Head tracking is limited to 3DoF (three degrees of freedom).

In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform.^[356][357]

The Razer Edge is the first device to use the platform.^[358]

The G3x Gen 1 is based on the Snapdragon 888+ as it has the same motherboard code name (Lahaina), the same CPU clusters

with higher clock speeds, and the same GPU with a higher clockspeed. Connectivity options also seem in line.^[359]

In August 2023, Qualcomm announced the Snapdragon G series platform designed for handheld gaming devices.^[360]

On March 19, 2025, Qualcomm revealed the Snapdragon G3 Gen 3, G2 Gen 2, and G1 Gen 2 platforms.^[361]

Product name	Fab	CPU (Cores/Freq)	GPU	Modem	Connectivity	Display	Sampling availability
G1 Gen 1[362]	Un­known	Kryo (8 core)	Adreno A11	—	Bluetooth 5.0; 802.11a/b/g/n/ac (Wi-Fi 5) 1x1	HD at 60 fps	Q4 2023
G1 Gen 2[363]	4 nm (Samsung 4LPX)	2 + 6 cores (2x 2.4 GHz Kryo Gold – Cortex-A78 + 6x 1.96 GHz Kryo Silver – Cortex-A55)	Adreno A12 1010 MHz (258.6 GFLOPS in FP32)	X61 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 900 Mbit/s)	Bluetooth 5.1; 802.11a/b/g/n/ac (Wi-Fi 5) 1x1	FHD+ up to 120 fps	Q1 2025
G2 Gen 1[364]		Kryo 4 + 4 cores (Cortex-A78 + Cortex-A55)	Adreno A21	X62 5G/LTE (5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s)	FastConnect 6700; Bluetooth 5.0; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s;	FHD+ up to 144 fps	Q4 2023
G2 Gen 2[365]	4 nm (TSMC N4P)	Kryo (Cortex-X4 + 4× Cortex-A720 + 3× Cortex-A520)	Adreno A22	X61 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 900 Mbit/s)	FastConnect 7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s	QHD+ up to 144 fps	Q1 2025
G3x Gen 1[366]	5 nm (Samsung 5LPE)	1x 3.0 GHz Kryo 680 Prime (Cortex-X1) + 3x 2.42 GHz Kryo 680 Gold (Cortex-A78) + 4x 1.80 GHz Kryo 680 Silver Cortex-A55)	Adreno 660 900 MHz (1382.4 GFLOPs in FP32)	X60 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)	FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s	FHD+ up to 144 fps	Q1 2023
G3x Gen 2[367][368]	4 nm (TSMC N4)	1× 3.36 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715 2× Cortex-A710) + 3× 2.02 GHz Kryo Silver (Cortex-A510)	Adreno A32 1000 MHz (3072 GFLOPS in FP32)	X70 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)	FastConnect 7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s		Q4 2023
G3 Gen 3[369]	4 nm (TSMC N4P)	1× (Cortex-X4) + 5× (Cortex-A720) + 2× (Cortex-A520)	Adreno A33	X61 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 900 Mbit/s)		QHD+ up to 144 fps	Q1 2025

Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair.^[370][371] Qualcomm announced the QCC5100 Series at CES 2018.^[372]

On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG.^[373][374] On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series.^[375] On March 25, 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.^[376][377]

Model number	Fab	CPU	DSP	Bluetooth	Technologies support	Power consumption	DAC output / Digital microphone input	Sampling availability
QCC3001[378]		RISC application processor (Up to 80 MHz)	Single core Qualcomm Kalimba DSP (Up to 80 MHz)	Bluetooth 5.0 Dual-mode Bluetooth	TrueWireless Stereo cVc audio		Mono / 2-mic
QCC3002[379]					TrueWireless Stereo aptX Classic/HD/LL cVc audio
QCC3003[380]					cVc audio		Stereo / 1-mic
QCC3004[381]							Stereo / 2-mic
QCC3005[382]					aptX Classic/HD/LL cVc audio

Model number	Fab	CPU	DSP	Bluetooth	Technologies support	Power consumption	DAC output / Digital microphone input	Digital assistant activation	Sampling availability
QCC3020[383]		Dual core 32-bit application processor (Up to 80 MHz)	Single core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s	aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio	~6mA (2DP streaming)	Mono / 2-mic	Button press	H1 2017
QCC3021[384]							Stereo / 1-mic
QCC3024[385]					cVc audio Google Fast Pair		Stereo / 2-mic
QCC3026[386]					aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio		Mono / 2-mic
QCC3031[387]					aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio		Stereo / 1-mic
QCC3034[388]					aptX Classic/HD/LL cVc audio Google Fast Pair		Mono / 2-mic
QCC3040[389]		Dual core 32-bit application processor (Up to 80 MHz)	Single core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.2[373][374] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Bluetooth speed: 2 Mbit/s	aptX Classic/HD TrueWireless mirroring ANC (Feedforward/feedback and hybrid) cVc audio Google Fast Pair	<5 mA	Stereo / 2-mic	Button press	H1 2020
QCC3046[390]						<5 mA

Model number	Fab	CPU	DSP	Bluetooth	Technologies support	Power consumption	Digital assistant activation	Sampling availability
QCC5120[391]		Dual core 32-bit application processor (Up to 80 MHz)	Dual core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s	aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback and Hybrid) cVc audio Google Fast Pair	~6mA (2DP streaming) ~7mA HFP Narrow Band, 1 Digital MIC cVc	Button press Qualcomm Voice Activation	H1 2018
QCC5121[392]
QCC5124[393]
QCC5125[394]			Single core Qualcomm Kalimba DSP (Up to 120 MHz)		aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback) cVc audio Google Fast Pair	~10mA (2DP streaming) ~10mA HFP Narrow Band, 1 Digital MIC cVc	Button press
QCC5141[395]		Dual core 32-bit application processor (Up to 80 MHz)	Dual core Qualcomm Kalimba DSP (Up to 120 MHz)	Bluetooth 5.2[373][374] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s	aptX Adaptive eXtension program TrueWireless Mirroring ANC (FeedForward/Feedback) cVc audio Google Fast Pair	~5mA A2DP stream	Button press Qualcomm Voice Activation	H1 2020
QCC5144[396]

• List of devices using Qualcomm Snapdragon systems on chips
• Qualcomm Adreno
• Qualcomm Hexagon
• List of Qualcomm Snapdragon modems
• Apple M1
• Tegra
• Exynos
• HiSilicon
• List of MediaTek systems on chips
• List of UNISOC systems on chips